Silicon for computer chips is grown in large cylinders called "boules" that are 300 mm in diameter and 2 m in height. The density of silicon is 2.33 g/cm3. Silicon wafers for making integrated circuits are sliced from a 2.0 m boule and are typically 0.75 mm thick and 300 mm in diameter.

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ganeshie8 · Answer

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using a diamond saw, you cut this cylinder into slices

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ganeshie8 · Answer

Each wafer has a thickness of 0.75mm. So, for a 2m boule, you would get 2m/0.75mm = 2000/0.75 wafers

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Is there a question attached to the given info ha ?